3M and IBM announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” Processors could be tightly packed with memory and networking, for example, into a “brick” of silicon that would create a computer chip 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
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You still need to communicate between the different layers. How do they propose to do that?