If you’ve ever wondered why people tend to avoid BGA, it isn’t only the cost associated with multi-layer PCBs, it’s also because it’s impossible to inspect them after they have been soldered to way you would a QFP chip for solder bridges, etc. The solution in any professional production line is simple … they all get scanned with a specialised XRAY machine. The image above is from a board I had reworked, and wanted to make sure everything was OK underneath since I only had one sample. I thought the results were worth sharing. The solid black boxes underneath are capacitors on the bottom side of the board directly beneath the BGA chip.
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1 Comment
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I’ve noticed in your image and other boards I’ve seen inspected how opaque to X-rays some capacitors can be. Also, it is humbling to see how big the vias are. In layout programs, vias just seem a quick jump to the next layer, but that layer can be 2 to 30 or more mils away.