An improved method for transferring electrical components from a breadboard to a printed circuit board and mounting the components thereon is disclosed, as well as an apparatus for facilitating such transfer and mounting. In a preferred case, the breadboard comprises a solderless breadboard socket. A printed circuit board having a drilled hole pattern and circuit pattern matching that of a solderless breadboard socket is placed over the solderless breadboard socket so that the holes in each are aligned. Breadboarding is done by pushing the leads of various components through the printed circuit board and into the solderless breadboard socket. When the desired circuit is completed, the composite is utilized as one side of a container with the component side forming an inner surface thereof. Particles smaller than the components, such as polymer pellets, are introduced into the container to surround and cover the components and hold the components in place.
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Somebody was selling prototyping boards based on this idea just a couple of years ago under the “Lab-Easy” brand. I liked the boards — never used them in exactly the way the patent describes — but they’re not very common in the stores anymore. The website has gone very quiet.
Somebody was selling prototyping boards based on this idea just a couple of years ago under the “Lab-Easy” brand. I liked the boards — never used them in exactly the way the patent describes — but they’re not very common in the stores anymore. The website has gone very quiet.