Personally, I’ve found all the little acronyms when looking for components to be a little confusing and I’m sure that I’m not the only one that’s been through that. Whats a TSSOP? Whats the difference between SIP and DIP? It can get very frustrating, so this will explain everything for you!
Well there are many different components out there and with that, there have to be different packages to fit different needs such as space availability, prototyping, and different circuit board layouts. The entire list of the more well-known packages, others may be lurking in R&D that we don’t know about, goes something like this : CDIP , PDIP , SPDIP, SIP, SDIP, SOIC, TSOP, SSOP, TSSOP, PLCC, QSOP, VSOP, LQFP, PQFP, CQFP, TQFP, CGBA, and QFN. Its mostly all about space on the board, which kind of package utilizes the precious space on the circuit board the best. So lets start with the descriptions!
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