If you’ve ever been curious about how to properly define BGA footprints or what patterns to use for BGA ‘fan-out’ (breaking the signals out from underneath the chip), AN10778 from NXP provides a lot of helpful information on some common BGA packages. 1.0mm and 0.8mm pitch BGA actually aren’t that bad to work with and you don’t need to pay for super-exotic tolerances from your board house, plus bridges underneath are reasonably rare if you have a good paste layer and footprint. It does get a lot more challenging and expensive from 0.65mm and lower, but NXP provides some good suggestions and clear numbers on how to handle both situations.
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