If you’ve ever been curious about how to properly define BGA footprints or what patterns to use for BGA ‘fan-out’ (breaking the signals out from underneath the chip), AN10778 from NXP provides a lot of helpful information on some common BGA packages. 1.0mm and 0.8mm pitch BGA actually aren’t that bad to work with and you don’t need to pay for super-exotic tolerances from your board house, plus bridges underneath are reasonably rare if you have a good paste layer and footprint. It does get a lot more challenging and expensive from 0.65mm and lower, but NXP provides some good suggestions and clear numbers on how to handle both situations.
Have an amazing project to share? Join the SHOW-AND-TELL every Wednesday night at 7:30pm ET on Google+ Hangouts.
Join us every Wednesday night at 8pm ET for Ask an Engineer!
Learn resistor values with Mho’s Resistance or get the best electronics calculator for engineers “Circuit Playground” – Adafruit’s Apps!
Maker Business — Raspberry Pi and CoderDojo Join Forces
Wearables — Gold glow
Electronics — Linear Love
Biohacking — Nike’s Unlimited Stadium Will Put Your Best Foot Forward
Sorry, the comment form is closed at this time.