Limor sent this wonderful little document my way after we had some problems with a 0.4mm pitch footprint I made, just to see if we could improve the paste layer and reduce the bridging a bit: Root Cause Failure Analysis of Printed Circuit Board Assemblies. Despite the organization not being the best — a clearer separation of problems from potential solutions/recommendations would have been helpful — there’s a lot of useful information in here. It’s often easier to understand the kinds of problems you encounter working with fine-pitch devices looking at photos. Unfortunately, X-ray images of things like ‘ball-drop’ with BGA reflow aren’t easy to come by, nor post-mortem, sawed-in-half BGA packages, etc. If you’re fascinated by the many ways boards can die a premature death, this is a goldmine of info.
Have an amazing project to share? Join the SHOW-AND-TELL every Wednesday night at 7:30pm ET on Google+ Hangouts.
Join us every Wednesday night at 8pm ET for Ask an Engineer!
Learn resistor values with Mho’s Resistance or get the best electronics calculator for engineers “Circuit Playground” – Adafruit’s Apps!
Maker Business — Toys R Us will have Raspberry Pi ?
Wearables — Foam to leather
Electronics — Proceed with caution
Biohacking — Machine Learning and Ketosis
No comments yet.
Sorry, the comment form is closed at this time.