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June 5, 2013 AT 2:00 am

Inter-Metallic Formation in Lead Free Solder After Thermal Cycling


Inter-metallic formation in Lead Free Solder after Thermal Cycling on reedit:

The inter metallics you can see are:

Ag3Sn – Needle like structures

Cu6Sn5 – blotchy spots all around solder ball and typically the layer between the ball and the pad(s)

This cross section was taken from a Package on Package components which was thermally cycled from -25 C to 125 C (30 min dwell) for 1000 cycles.

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