June 5, 2013 AT 2:00 am
Inter-Metallic Formation in Lead Free Solder After Thermal Cycling
Inter-metallic formation in Lead Free Solder after Thermal Cycling on reedit:
The inter metallics you can see are:
Ag3Sn – Needle like structures
Cu6Sn5 – blotchy spots all around solder ball and typically the layer between the ball and the pad(s)
This cross section was taken from a Package on Package components which was thermally cycled from -25 C to 125 C (30 min dwell) for 1000 cycles.
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