We are at the APEX Expo looking for an additional reflow oven, we are checking out the BTU Pyramax reflow oven.
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging.
Pyramax™ systems provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry.
With 6, 8, 10 and new 12-zone air or nitrogen models, 350oC maximum temperature and a comprehensive menu of options, Pyramax™ systems are the industry’s most versatile performers and best value. The Pyramax features BTU’s proprietary WINCON™ control system. WINCON features a simplified user interface and incredibly powerful analytical capabilities.
Thousands of industry professionals from more than 50 countries attend this premier event— featuring advanced and emerging technologies in printed board design and manufacturing, electronics assembly, test and printed electronics! Find new suppliers with new solutions and connect with colleagues from around the world.
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