We are at the APEX EXPO looking for an additional reflow over, we are checking out the HELLER 1809 Mark III Series – SMT Reflow Oven.
The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.
Highest Yields and Tight Process Control – The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy board loads.
Wide process window for “universal profiling” – allows many different boards to be run on a single temperature profile
Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs
With a high-capacity, 26-inch wide heater module, the 1800 Mark III series reflow oven offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/mesh belt combo, to carry even the largest boards or multi-board panels (up to 20 inches wide) through the oven.
Thousands of industry professionals from more than 50 countries attend this premier event— featuring advanced and emerging technologies in printed board design and manufacturing, electronics assembly, test and printed electronics! Find new suppliers with new solutions and connect with colleagues from around the world.
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