Scrutinizing PCBs Post-Reflow for Typical SMT Problems: Tombstoning, Bridging, Spattering, Solder Balls and More
Here’s a great quick read by Bob Baddeley for Hackaday on some of the more common problems encountered during SMT reflow, along with subsequent inspection and testing options.
In the last episode, we put our circuit boards through the reflow process. Unfortunately, it’s not 100% accurate, and there are often problems that can occur that need to be detected and fixed. That’s what the inspection step is for. One could insert an inspection step after paste, after placement, and after reflow, but the first two are icing on the cake — the phase where most mistakes can be caught is after reflow.
Adafruit has had paid day off for voting for our team for years, if you need help getting that going for your organization, let us know – we can share how and why we did this as well as the good results. Here are some resources for voting by mail, voting in person, and some NY resources for our NY based teams as well. If there are additional resources to add, please let us know – adafruit.com/vote
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