Scrutinizing PCBs Post-Reflow for Typical SMT Problems: Tombstoning, Bridging, Spattering, Solder Balls and More
great quick read by Bob Baddeley for Hackaday on some of the more common problems encountered during SMT reflow, along with subsequent inspection and testing options.
In the last episode, we put our circuit boards through the reflow process. Unfortunately, it’s not 100% accurate, and there are often problems that can occur that need to be detected and fixed. That’s what the inspection step is for. One could insert an inspection step after paste, after placement, and after reflow, but the first two are icing on the cake — the phase where most mistakes can be caught is after reflow.
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