Thanks to Gregor van Egdom for sharing his teardown with us! Check out the full post here.
A few weeks ago, I took an LG G3 smartphone apart to repair the screen. I hadn’t disassembled a recent smartphone for a while, so there were some interesting finds which I’ll document here. My apologies for the crappy photos.
Most noticeable was the headphone port, which is a discrete part with springy connectors on the side. These mate to an edge-connector on the PCB. The part was mounted only to the enclosure (with adhesive), not to the board. Since the headphone port gets to endure considerable stress from the forces of the earphones, this makes for an interesting solution to headphone ports fatigue-cracking from the PCB. This should make the phone more durable (on that part; it has other issues like easy moisture ingress). It’s also easier to replace.
Another interesting solution visible in these photos is the MEMS-microphone, which has its sound-cavity-opening on the bottom in stead of the top. On the bottom of the board is a small piece of filter or membrane which keeps out dust (and maybe moisture as well?). The phone features three of these, with the other two used for noise-cancellation.
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