danman recently decapped three integrated circuits (IC) using only hot air (when it usually takes some nasty acid bath):
Recently I saw an interesting video about chip decapping using only hot air. It looked quite easy so I gave it a try and indeed I managed to extract three dies without breaking them or any other problems so it was 100% successful on first try.
You can see die pictures (above). From left to right: GD32F103C8T6 main die, it’s flash and MAX7219
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