MediaTek plans to use Intel process technologies to manufacture multiple chips for a range of smart edge devices. IFS offers a broad manufacturing platform with technologies optimized for high performance, low power and always-on connectivity built on a roadmap that spans production-proven three-dimensional FinFET transistors to next-generation breakthroughs.
As TSMC continues to hold the majority of semiconductor production, Intel is looking to compete. The more partners they can fab for, the more the can invest in foundries. Intel is trying to take advantage of U.S. initiatives for domestic fab production and this type of business will help.
IFS was established in 2021 to help meet the surging global demand for advanced semiconductor manufacturing capacity. IFS is differentiated from other foundry offerings with a combination of leading-edge process and packaging technology, a world-class IP portfolio, and committed capacity in the United States and Europe. IFS customers will reap the benefits of Intel’s recently announced factory expansions at existing sites, as well as plans for major new investments in greenfield sites in Ohio and Germany.
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